- Renesas’ Radiation Hardened ICs Take Flight on NASA’s Artemis II Crewed Lunar Mission
- Anritsu Expand General Purpose Instruments Portfolio via TTi Sales Agreement
- Tria Technologies brings multi-OS support to Qualcomm-based hardware
- Melexis Enables Fast, Code-Free Three-Phase Fan Design with Intuitive Motor Driver
- Toshiba launches 40V, 0.67mΩ N-channel MOSFET using latest-generation process technology to enhance power supply efficiency
- Würth Elektronik introduces heat sinks for power-electronics and IC components
- Authorised Distributor Mouser Electronics Offers Engineers the Latest in Secure Component Solutions from NXP Semiconductors
- Arrow Electronics Announces New Single Pair Ethernet Reference Design Featuring Bourns, Microchip and Amphenol Technology
- Infineon launches industry first TLVR quad phase module exceeding 2 A/mm² for next generation AI compute
- XSENS MTi-8 Click from MIKROE provides RTK-enhanced GNSS and inertial navigation system (INS) solution
- Introducing Automotive-Qualified System-in-Package Hybrid MCU for Automotive and E-Mobility Human-Machine Interface Applications
- Infineon and DG Matrix leverage silicon carbide technology to advance power infrastructure for AI data centers
- element14 Community launches smart industry design challenge
- Wireless modules for embedded systems now available from Tria Technologies
- Würth Elektronik presents a new power inductor for automotive electronics